Silicon Photonic Package Reliability and Qualification Engineer
Core
Direct reliability assessment and qualification of advanced silicon photonic optical engine packages, ensuring robust solutions for integration into optical transceiver portfolios.
Role type
Senior IC reliability and qualification engineer (silicon photonics packaging)
Builds
Robust optical packaging solutions for pluggable optical modules
Domain
Semiconductor backend packaging / Silicon Photonics
Required skills
Reliability assessment and qualification planning, Failure Analysis (FA) techniques, Thermomechanical failure mode identification, Advanced packaging technology knowledge (Flip-Chip, 2.5D/3D), Industry standards expertise (JEDEC, IPC, Telcordia), Metrology and material characterization
Preferred skills
Silicon Photonics domain expertise, Thermomechanical simulation (ANSYS FEA), OSAT vendor management
Technologies
ANSYS FEA, SEM, EDX, X-ray, SAT
Responsibilities
Define and execute comprehensive reliability qualification plans for complex optical engine architectures, Lead root-cause analysis on reliability test failures and field returns, Partner with design and process teams to identify and resolve thermomechanical and optical failure modes, Ensure optical engine reliability aligns with system-level requirements for module integration
Seniority
Senior, hands-on IC