Staff Process Integration Engineer
Core
Oversee wafer fabrication processes for manufacturing III-V Semiconductor optoelectronic devices (Edge Emitting Lasers, VCSELs) and translate designs into operational chips.
Role type
Staff Process Integration Engineer (III-V Semiconductor Manufacturing)
Builds
III-V based laser chip products (Edge Emitting Lasers, VCSELs) for telecom, enterprise, and data center networks
Domain
Semiconductor manufacturing / Optoelectronics / III-V compound semiconductors
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
III-V compound semiconductor wafer processing, optical grating patterning, lithography, dry and wet etching, dielectric and metal deposition, implantation, diffusion, statistical data analysis, Six Sigma methodologies (FMEA, Capability Analysis, SPC, DOE, DFM), custom tool design and automation programming, yield improvement, root cause analysis
Preferred skills
Optical bench/system setup and maintenance
Technologies
JMP, Minitab, Excel VBA, LabVIEW, C++, Visual Basic, Matlab
Responsibilities
Integrate individual processing steps and process modules to create process flows, develop new process modules for novel chips, design and improve custom tools based on optical table setups, serve as process expert for daily production support, lead chip failure analysis, perform statistical data analysis to improve processes and reduce defects, collaborate with foundry team to meet yield targets, deliver NPI projects on schedule
Seniority
Staff, hands-on IC with strategic oversight
