Optical-Electronic Packaging Engineer
Core
Design and develop mechanical packaging solutions for high-speed optical modules used in AI and data center interconnect systems.
Role type
Senior IC mechanical packaging engineer (optical modules)
Builds
High-density, high-power optical modules for AI and data center applications
Domain
Semiconductor/Photonics industry, optical interconnects
Deliverable
production ML models | product features
Required skills
Mechanical design, thermal simulation (FEA), GD&T, tolerance stack-up analysis, high-density packaging design, DFM/DFA, CAD/FEA tools proficiency
Preferred skills
Optoelectronic product development, data analysis tools, basic scripting/programming
Technologies
SolidWorks, FloTHERM, JMP, VB, C, MATLAB
Responsibilities
Define mechanical package solutions from concept to production ramp, develop 3D CAD models and engineering documentation, perform thermal and mechanical stress analysis, design fixtures and test infrastructure, collaborate with cross-functional teams, provide technical direction and mentorship for senior roles
Seniority
Senior, hands-on IC with technical leadership