Director, Hardware Engineering (Client Optics Group)
Core
Leading a high-performance engineering design team to drive end-to-end execution of optical transceiver development for silicon-photonics-based chipsets and modules.
Role type
Director, Hardware Engineering (Client Optics Group)
Builds
Silicon-photonics-based transceiver chipsets and modules
Domain
Semiconductor / Optics / Silicon Photonics
Deliverable
production ML models | product features
Required skills
Mixed-signal/analog electronics design, Silicon photonics development, High-speed SERDES (112Gbps–448Gbps), Signal & power integrity, Advanced packaging, PLL/clock domains, Silicon diagnostics and test coverage, AI tool adoption for engineering
Preferred skills
Silicon manufacturing process understanding, Optical transceiver architecture at 200Gbps/400Gbps lane, MSA standards (QSFP/QSFP-DD, IEEE 802.3)
Technologies
EIC, PICs, DSP, Co-simulation tools, Silicon validation equipment
Responsibilities
Evaluate MRDs and define approach/timeline for new product concepts, Oversee design and delivery of electronics ICs and chipsets, Mentor and develop high-performing global teams, Partner with cross-functional teams for program delivery, Apply AI/ML to optimize test strategies and debug capabilities
Seniority
Director, large-team leadership
