Applikationsingenieur / Anwendungsingenieur Halbleiter (m/w/d)
Core
Technical interface between customer, sales, and product management, designing complex interconnection processes in microelectronics assembly and joining technology.
Role type
Senior IC application engineer (microelectronics assembly)
Builds
Customer-specific solutions for microelectronics assembly and joining technology, integrated into production processes
Domain
Semiconductor manufacturing / Microelectronics / Assembly and joining technology
Required skills
Microelectronics engineering, Process integration, Feasibility studies, Technical consulting, Cross-functional thinking, International project management
Preferred skills
Knowledge of adhesive and joining technologies, Mobile work capability
Technologies
Microelectronics assembly tools, Joining technologies
Responsibilities
Handle complex adhesive and joining tasks in microelectronics assembly, Develop customer-specific solutions up to process integration, Provide technical consulting to international customers, Introduce technologies into customer production processes, Conduct feasibility studies and derive appropriate measures, Continuously monitor state-of-the-art and develop own expertise
Seniority
Senior, hands-on IC
