板级先进工艺设计工程师
Core
Design end-to-end board-level assembly and reliability solutions for high-density computing products, focusing on large chip assembly, warpage engineering, and mixed-module integration.
Role type
Senior IC board-level process and reliability engineer
Builds
High-density computing PCBAs and mixed-integration modules
Domain
Electronics manufacturing / Semiconductor packaging / Reliability engineering
Required skills
DFM/DFR/DFA design, mechanical reliability simulation (Hypermesh/Abaqus), PCB material selection, solder joint thermal cycling analysis, mixed-module integration, failure analysis (micro-CT, SEM), SMT/reflow/laser welding process knowledge
Preferred skills
Experience with large chip assembly, thermal interface material development, warpage simulation, high-frequency PCB stack-up design
Technologies
Hypermesh, Abaqus, ProE, AutoCAD, SMT, reflow, wave soldering, laser welding
Responsibilities
Design end-to-end board-level assembly and reliability schemes; Develop root technologies for large chip assembly and thermal/mechanical reliability; Lead process technology planning and platform capability building; Perform failure analysis and root cause resolution for reliability issues
