DFM Engineer
Core
Lead DFM/DFR for optical transceiver manufacturing processes including SMT, Die Attach, Wire Bonding, Flip Chip, TCB Bonding, Underfill, FAU Active Alignment, Mechanical Assembly, and Reliability Tests.
Role type
Senior IC DFM Engineer (Optical Transceivers)
Builds
High-speed photonics products for AI infrastructure and high-performance computing
Domain
Semiconductor manufacturing / Optical engineering
Required skills
Transceiver assembly process development, Material science (solder, epoxy, glass, ceramic), Equipment operation (SMT, die bonder, active aligner, TCB bonding), Component integration (FR4, PIC chip, EIC chip, FAU, SMD), Data review and report summarization, Cross-functional execution
Preferred skills
None stated
Technologies
Cadence, Solidworks, JMP
Responsibilities
Lead DFM/DFR for various transceiver designs (pluggable, NPO, CPO), Perform capability assessment and risk analysis of processes, machines, and materials, Engage with packaging production teams during early process development to collect data and summarize for decision making
Seniority
Senior, hands-on IC