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DFM Engineer

Singapore💼 Full-time🗓 2026-08-17 → 2026-09-27

Core

Lead DFM/DFR for optical transceiver manufacturing processes including SMT, Die Attach, Wire Bonding, Flip Chip, TCB Bonding, Underfill, FAU Active Alignment, Mechanical Assembly, and Reliability Tests.

Role type

Senior IC DFM Engineer (Optical Transceivers)

Builds

High-speed photonics products for AI infrastructure and high-performance computing

Domain

Semiconductor manufacturing / Optical engineering

Required skills

Transceiver assembly process development, Material science (solder, epoxy, glass, ceramic), Equipment operation (SMT, die bonder, active aligner, TCB bonding), Component integration (FR4, PIC chip, EIC chip, FAU, SMD), Data review and report summarization, Cross-functional execution

Preferred skills

None stated

Technologies

Cadence, Solidworks, JMP

Responsibilities

Lead DFM/DFR for various transceiver designs (pluggable, NPO, CPO), Perform capability assessment and risk analysis of processes, machines, and materials, Engage with packaging production teams during early process development to collect data and summarize for decision making

Seniority

Senior, hands-on IC

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