Semiconductor Manufacturing & Architecture Analyst
Core
Conduct end-to-end teardown and characterization of AI and datacenter hardware (package → die → transistor level) to generate evidence-based technical insights on process technology, integration strategies, and design intent.
Role type
Senior IC semiconductor manufacturing and architecture analyst (teardown & characterization)
Builds
Technical research, industry models, and competitive analysis reports for clients in the semiconductor and AI industries
Domain
Semiconductor manufacturing, advanced packaging, and AI/datacenter hardware architecture
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery
Required skills
Semiconductor process integration (FEOL/BEOL), advanced packaging integration, silicon/hardware engineering, analytical tool operation (FIB, SEM), technical writing, DTCO principles, sample preparation, data interpretation
Preferred skills
X-ray analysis, TEM/STEM/EELS/EDS/SIMS/XRF/XPS, failure analysis (nanoprobing, emission microscopy), Python for image analysis/data processing, advanced packaging R&D (2.5D/3D integration, hybrid bonding)
Technologies
FIB, SEM, TEM, STEM, EELS, EDS, WDS, SIMS, XRF, XPS, Python
Responsibilities
Conduct physical teardown and characterization of leading-edge hardware; operate analytical tools to interpret imaging and compositional data; analyze FEOL, BEOL, and packaging trends; identify generational technology shifts and competitive positioning; apply DTCO principles to explain design/process decisions; produce high-quality technical research and publications
Seniority
Senior, hands-on IC
