Engineering Technician / Micro-Electronic Wire Bonder Technician
Core
Assembles electronic and electro-mechanical subassemblies, specifically performing precision micro-electronics work including wire bonding under a microscope to support production and engineering.
Role type
Micro-Electronic Wire Bonder Technician
Builds
Printed circuit assemblies (PCAs), modules, and subassemblies
Domain
Electronics manufacturing / Micro-electronics
Required skills
Wire bonding (ball and wedge), Soldering and de-soldering, Microscope operation, PCB assembly, Schematic interpretation, ESD controls compliance, Rework and repair, Quality inspection, Epoxy application and curing, Hand tool usage
Preferred skills
IPC standards familiarity, Technical training in electronics assembly, Troubleshooting skills
Technologies
Wire bonding equipment, Microscopes, Soldering irons, Jigs and fixtures
Responsibilities
Assemble electronic and electro-mechanical subassemblies following production drawings; Perform precision micro-electronics assembly including wire bonding; Install and connect electronic components onto PCBs; Perform soldering and de-soldering; Set up, operate, and maintain wire bonding equipment; Inspect wire bonds and assemblies using microscopes; Perform rework, repair, and troubleshooting; Conduct in-process inspections and visual checks; Maintain accurate production records.
Seniority
Entry to Mid-level, hands-on IC