Manager, Manufacturing Process Engineering
Core
Lead a team of process and equipment engineers to support high-reliability semiconductor, hybrid microcircuit, and optoelectronic device manufacturing at Teledyne Micropac.
Role type
Manager, Manufacturing Process Engineering
Builds
High-reliability semiconductor, hybrid microcircuit, and optoelectronic devices
Domain
Aerospace and defense manufacturing; microelectronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
root-cause analysis, process optimization, equipment troubleshooting, IQ/OQ/PQ validation, DOE design, AS9100 compliance, team leadership, continuous improvement, lifecycle management, document control
Preferred skills
wire bonding, die attach, hermetic sealing, hybrid assembly, WestBond, K&S, X-ray inspection, leak detection, laser tools, CAPEX project management
Technologies
WestBond, K&S, X-ray inspection, leak detection, laser tools
Responsibilities
Serve as primary technical escalation point for equipment failures and process deviations; Lead structured problem-solving and root-cause analysis; Validate process changes through IQ/OQ/PQ, capability studies, and DOEs; Maintain and improve SOPs, travelers, PFMEAs, control plans, and specifications; Drive continuous improvement to reduce scrap and improve yields; Manage and develop a team of process and equipment engineers; Coordinate with Facilities and Maintenance to maximize equipment uptime
Seniority
Manager, hands-on IC with team leadership
