Staff Failure Analysis Engineer
Core
Performing package and die level failure analysis of analog and mixed signal ICs from customer returns and internal failures to determine root causes.
Role type
Staff Failure Analysis Engineer (Semiconductor)
Builds
Formal technical reports summarizing analysis results for customers and internal stakeholders.
Domain
Semiconductor manufacturing and reliability
Deliverable
physical/clinical work
Required skills
Semiconductor IC failure analysis, operating FA equipment (Curve Tracer, SEM/EDX, Microprober), physical FA steps (decapsulation, lapping, cross-sectioning), bench testing and instrumentation, IC fabrication knowledge, semiconductor physics, BJT and MOSFET theories
Preferred skills
FIB X-sectioning, Circuit Edit, ion milling techniques, Product Quality and Reliability experience, Wafer Fab experience
Technologies
Scanning Acoustic Microscope, SEM/EDX, Photon Emission/Laser Signal Injection Microscope, Microprober
Responsibilities
Perform package and die level failure analysis of customer returns and internal failures, Generate formal FA reports for customers and internal requestors, Work with engineering teams for root cause analysis and resolution, Participate in continuous FA technique development and process improvements
Seniority
Staff, hands-on IC
