Quality Process Engineer - Semiconductor Manufacturing
Core
Drive corrective action closure and technical problem-solving for chip-scale packaging processes in semiconductor backend assembly.
Role type
Quality Process Engineer (Semiconductor Packaging)
Builds
High-performance semiconductor solutions (circuit protection, RF, power management ICs) for mobile, industrial, medical, and infrastructure markets.
Domain
Semiconductor Manufacturing / Analog Mixed Signal
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
root cause analysis (8D, 5-Why, fishbone), Design of Experiments (DOE), Statistical Process Control (SPC), Measurement System Analysis (MSA), process capability analysis (Cpk/Ppk), FMEA, Control Plans, supplier quality management, semiconductor packaging knowledge (flip chip, die attach, molding, plating)
Preferred skills
Six Sigma Green/Black Belt, Certified Quality Engineer (CQE), ISO 9001/IATF 16949 Lead Auditor, wafer fabrication experience, reliability testing, semiconductor metrology
Technologies
Minitab, JMP, Microsoft Office
Responsibilities
Lead cross-functional corrective action reviews and drive closure of open CARs; investigate and resolve packaging quality issues (solder integrity, die cracking, warpage); support NPI through process validation and first article inspection; maintain quality documentation and support ISO 9001/IATF 16949 audits; manage supplier non-conformances.
Seniority
Mid-Senior, hands-on IC