Application Engineer II: Signal Integrity & Power Integrity
Core
Support customers in the deployment and adoption of Cadence Signal Integrity, Power Integrity, and Board Design solutions, assisting with debugging and optimizing designs involving System Design, Board, Package, Heterogenous integrated 3D-IC, and High-Speed Interfaces.
Role type
Application Engineer II: Signal Integrity & Power Integrity
Builds
Signal Integrity, Power Integrity, and Board Design solutions for electronic systems and semiconductor companies
Domain
Electronics design, semiconductor, high-speed interconnects, 3D-IC
Deliverable
client delivery
Required skills
System level Signal Integrity, Power Integrity, EM field solver technologies, Serial and parallel high-speed interfaces, 2D/3D Signal waveforms analysis, S-parameter results extraction, EMI-EMC simulations, EDA environments, Linux-based workflows
Preferred skills
Thermal analysis, Mentorship expertise
Technologies
EDA environments, Linux
Responsibilities
Support customers in the deployment and adoption of SI/PI/Board Design solutions; Assist customers in debugging and optimizing designs; Drive methodology and solution-oriented discussions with key stakeholders; Collaborate with R&D and field teams to reproduce issues and improve tool usability; Develop technical documentation and examples to improve customer self-service
Seniority
Mid-level, hands-on IC
