CMP/Backlap Area Equipment Engineer
Core
Monitor, sustain, and improve CMP and Backlap equipment and processes in the BEOL equipment group to ensure tool uptime and process stability.
Role type
Senior IC equipment engineer (CMP/Backlap)
Builds
Semiconductor manufacturing equipment uptime and process yield
Domain
Semiconductor manufacturing (BEOL)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Electronics and control systems knowledge, mechanics/robotics, hydraulics, pneumatics, vacuum systems, equipment troubleshooting, SPC principles, MS Office proficiency, hand tool usage, PPE utilization, systematic root-cause analysis, documentation management
Preferred skills
AMAT Mira/Desica/Mesa/OnTrak experience, Disco backlap experience, Project Management, advanced SPC knowledge
Technologies
AMAT Mirra, Disco, Nitto, MS Office (Word, Excel, PowerPoint), Equipment Management System
Responsibilities
Monitor tool performance and modify PM frequencies/schedules, create and modify PM procedures and checklists, interface between process engineering and maintenance technicians, disassemble/repair/reassemble equipment per manuals and schematics, engage in systematic troubleshooting to identify root-cause of failures, minimize tool down-time and variability, document all maintenance activities, monitor and address SPC issues, drive CQI and cost reduction projects
Seniority
Mid-level, hands-on IC