Principal Engineer, Reliability Engineering
Core
Providing technical leadership in the reliability characterization, modeling, and qualification of GaN and Wide Bandgap (WBG) semiconductor devices to de-risk product development.
Role type
Principal Engineer, Reliability Engineering (GaN/WBG)
Builds
High-voltage (100V–650V) and power semiconductor products
Domain
Semiconductor industry, Analog and Power Electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
GaN device reliability, Wide Bandgap (WBG) technologies, Physics-of-Failure (PoF) analysis, lifetime modeling, HTGB/HTRB testing, transient stress testing, ATE-based test infrastructure, root-cause resolution, design guardbanding
Preferred skills
SiC, AlGaN technologies, next-generation reliability methodologies
Technologies
HTGB, HTRB, ATE, custom stress systems
Responsibilities
Drive GaN intrinsic reliability strategy across 100V–650V technologies; Define and execute reliability qualification methodologies; Lead physics-of-failure investigations; Develop and validate lifetime and reliability models; Drive product de-risking activities; Provide technical leadership on reliability risks and design recommendations; Develop and enhance intrinsic reliability test infrastructure
Seniority
Principal, technical leadership & domain expertise
