College Intern - Process & product development in PVD chambers in Hybrid bonding for SOIC (advanced packaging)
Core
Intern supporting process optimization and hardware characterization for Physical Vapor Deposition (PVD) chambers in hybrid bonding for System on Integrated Chips (SOIC) within advanced packaging.
Role type
Intern, Process & Product Development
Builds
PVD product features for advanced semiconductor packaging
Domain
Semiconductor manufacturing / Advanced packaging / Materials science
Deliverable
production ML models | product features
Required skills
PVD process optimization, metal film property measurement, data analysis, hardware characterization, Root Cause Analysis, troubleshooting
Preferred skills
semiconductor technologies, problem-solving, innovative cycles
Technologies
PVD chambers, hybrid bonding systems
Responsibilities
Optimize PVD processes and measure metal film properties; Perform hardware characterization on moderately difficult systems; Troubleshoot moderately complex process engineering issues with engineer guidance.
Seniority
Intern
