Panel-level Advanced Packaging Process Engineer (PVD)
Core
Provide on-site technical support and process optimization for PVD metal deposition systems in panel-level advanced packaging environments.
Role type
Senior IC process support engineer (panel-level PVD)
Builds
Panel-level semiconductor and heterogeneous integration products
Domain
Semiconductor manufacturing / Advanced packaging / Materials science
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
PVD metallization process expertise, DOE design and statistical data analysis, root cause analysis, large-format panel handling, customer-facing technical support, process stabilization
Preferred skills
FOPLP and chiplet integration knowledge, BEOL process flow understanding, wafer-level to panel-level environment transition, field engineering experience
Technologies
PVD (Physical Vapor Deposition), RDL metallization, seed/barrier deposition, panel-level platforms
Responsibilities
Install and qualify PVD metal deposition systems on panel platforms, optimize seed/barrier/RDL metal stack deposition, execute DOEs and analyze process data, diagnose and resolve complex process/equipment issues on large panels, address film uniformity and warpage challenges, mentor junior engineers
Seniority
Mid-Senior, hands-on IC
