Senior Engineer, Failure Analysis
Core
Perform physical, electrical, and material analysis on defective integrated circuits to localize defects, identify failure mechanisms, and provide root cause conclusions.
Role type
Senior IC failure analysis engineer
Builds
Semiconductor ICs and related solutions for digitized factories, mobility, and digital healthcare
Domain
Semiconductor manufacturing and failure analysis
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor device physics, IC packaging, wafer fabrication, failure mechanism analysis, analog/digital/mixed-signal circuit analysis, comprehensive FA workflows, SEM/EDX, TEM, FIB, microprobe, nanoprobe, decapsulation, wet/dry etching, de-processing, ATE data interpretation, technical writing
Preferred skills
Fab/assembly process experience, SPC, DOE, statistical analysis (JMP, Minitab, Python), 8D, FMEA, Six Sigma, patent/publication experience
Technologies
SEM/EDX, TEM, FIB, ELITE, iPhemos, microprobe, nanoprobe
Responsibilities
Perform detailed physical, electrical, and material analysis on defective ICs; Utilize advanced FA techniques (X-Ray, CSAM, Curve tracing, FI, microprobe, nanoprobe, SEM/EDX, TEM, FIB, delayering); Analyze customer returns, qualification lots, yield issues, and NPI samples; Prepare accurate FA reports; Work with product, process, test, design, and reliability teams; Support NPI ramp, reliability qualification, and yield improvement; Optimize FA workflow and establish SOPs; Evaluate new equipment and technologies; Ensure FA documentation compliance with ISO/IATF standards; Mentor junior engineers and technicians
Seniority
Senior, hands-on IC
