Failure Analysis OFI Engineer
Core
Apply failure analysis methods and techniques using OFI (Optical Fault Isolation) tools to identify root causes of semiconductor failures and support manufacturing teams.
Role type
Failure Analysis Engineer (Semiconductor)
Builds
Production quality assurance and yield improvement for semiconductor devices
Domain
Semiconductor manufacturing / Failure Analysis
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor device physics, FinFET fabrication process knowledge, Automated Test Equipment (ATE) testing, root cause analysis, report generation, sample selection, electrical and imaging data interpretation
Preferred skills
Hands-on experience with SEM, FIB, OBIRCH, PEM, Python scripting, layout software (Camelot/Avalon), Wafer Level Reliability stress data interpretation
Technologies
Photon, Thermal emission tools, Teradyne UFLEX, Advantest V93K/T2000, SEM, FIB, PVC, OBIRCH, PEM, Camelot, Avalon
Responsibilities
Conduct physical failure analysis from low yield lots and customer requests; Identify failure causes by selecting optimal analysis techniques; Support manufacturing teams with FA results for new process/product introduction; Represent the department in foundry customer meetings; Analyze electrical and imaging results to find root causes; Generate and compile quality FA reports
Seniority
Mid-level, hands-on IC
