Principal Fab Test Engineer
Core
Principal Test Engineer owning and optimizing wafer-level test tool groups for analog DC, Linear and Non-Linear RF parametric measurements on advanced silicon MEMs wafers.
Role type
Principal Fab Test Engineer (Unit Process Engineer)
Builds
Wafer-level probers and testers for development and production of analog and RF MEMs devices
Domain
Semiconductor manufacturing (Fab Test) / Analog & RF electronics
Deliverable
production ML models | product features | dashboards & analysis | infrastructure
Required skills
Wafer-level Analog DC, Linear RF, Non-Linear RF measurements (DC-20+ GHz), Probe card technologies (Cantilever, Vertical, GSG, Pyramid), Linux/Windows software programming, Python, Git Lab, Statistical Process Control (SPC), Design of Experiments (DOE), Root cause analysis, Tool FMEA creation, Vendor management for test components
Preferred skills
Test executive specification and down selection, CADENCE artwork review, VEE/JAVA/JSCRIPT/JSON programming, Fault Detection & Classification (FDC) systems, Lean Manufacturing, MEMS micro-fabrication techniques
Technologies
EG4090, TEL probers, Python, Git Lab, Linux, Windows, SECS/GEMS, JMP
Responsibilities
Provide technical leadership to identify, evaluate, improve and maintain owned tool sets; Lead improvement projects to support metrics of availability, uptime, capacity, maintenance cost, yield, quality and productivity; Investigate Lot Incident Reports and scrap events to identify root causes; Develop and implement operating and maintenance procedures; Create and update Tool Failure Mode and Effects Analysis (FMEAs); Work with suppliers to debug tool performance
Seniority
Principal, hands-on IC with strategic project leadership
