Internship in Semiconductor Packaging 80 - 100% (f/m/d)
Core
Intern supporting R&D in developing novel semiconductor power modules for e-mobility and grid applications.
Role type
Research intern (semiconductor packaging and reliability engineering)
Builds
Semiconductor power modules for e-mobility and grid applications
Domain
Semiconductor manufacturing / Power electronics / E-mobility
Deliverable
production ML models | product features | research
Required skills
Electrical engineering, Physics, Materials science, Analytical methods, Laboratory work, Experimental methods, Advanced materials characterization, Programming (LabVIEW, Python, Matlab), Finite element modeling, Data analysis, Statistics, CAD design
Preferred skills
Experience with ANSYS Q3D, COMSOL, Root cause analysis techniques (X-ray, SAM, cross section)
Responsibilities
Support process development and prototype manufacturing in a cleanroom, Perform accelerated lifetime testing and module characterization, Conduct root cause analysis and document test results, Perform electromagnetic and thermal simulations, Create CAD designs of power modules
Seniority
Intern
