Research Fellow (Flexible Electronics)
Core
Design, fabricate, and characterize bonded joints and interconnects for advanced electronic and flexible devices, bridging polymer science, supramolecular chemistry, and interfacial engineering.
Role type
Research Fellow (Flexible Electronics)
Builds
Bonding processes, interlayer/material systems, and device integration solutions for advanced packaging.
Domain
Materials Science / Flexible Electronics / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
diffusion bonding, brazing, soldering, interfacial joining, low-temperature bonding, metallurgical interface engineering, joint design, microstructural characterization, chemical characterization, mechanical characterization
Preferred skills
advanced/electronic packaging, heterogeneous integration, dissimilar-material joining, interfacial reaction and diffusion, microstructure-property relationships
Technologies
low-temperature bonding methods, analytical techniques for microstructural/chemical/mechanical characterization
Responsibilities
Design and fabricate bonded joints in dissimilar-material systems; Develop bonding processes for device integration; Conduct microstructural, chemical, and mechanical characterization; Collaborate on integrating bonding solutions into devices; Assist in manuscript preparation and grant development; Mentor junior researchers and manage laboratory operations
Seniority
Mid-level Research Fellow, hands-on IC
