Assembly Engineer(CN Campus)
Core
Monitor and improve performance of packaging factories in technology, quality, delivery, and cost; analyze yield and defect patterns to ensure product reliability and on-time delivery.
Role type
Assembly Engineer (Semiconductor Packaging)
Builds
Integrated Power Semiconductors and Systems Power delivery architectures
Domain
Semiconductor industry, packaging and testing
Required skills
Semiconductor packaging knowledge, quality analysis, yield monitoring, root cause analysis, supplier management, process evaluation
Preferred skills
Graduate degree in Electronic Engineering or Microelectronics, understanding of semiconductor industry
Technologies
SPC, packaging materials, packaging processes
Responsibilities
Handle packaging quality incidents and assist suppliers in finding causes and implementing corrective actions; Monitor and analyze packaging yield, scrap patterns, and SPC data to ensure reliable product quality; Resolve incoming chip issues at packaging suppliers and products held due to packaging problems; Assist FA engineers in analyzing packaging failures and proposing solutions with suppliers; Evaluate new packaging suppliers, materials, modes, and processes; Complete assigned tasks