SMT Technology Expert (Soldering & PCB assembly)
Core
Primary technical authority for resolving complex chip soldering defects at customer sites and optimizing SMT processes for semiconductor packages.
Role type
Senior SMT Technology Expert (Process Engineering)
Builds
High-yield, reliable semiconductor power delivery architectures and integrated power systems.
Domain
Semiconductor manufacturing / Surface Mount Technology (SMT) / Power Electronics
Deliverable
Production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Root-cause analysis of field failures, reflow profile optimization, solder material selection, DFM feedback, stencil design specification, PCB landing pad design review, package-to-board interaction guidelines, substrate design advice, surface finish selection
Preferred skills
IC Package Design influence, NPI standard establishment
Technologies
QFN, BGA, LGA, Type 4/5/6 solder powders, NiAu, ENIG, ENEPIG, OSP, Immersion Ag
Responsibilities
Act as technical leader for SMT-related issues (tombstoning, voiding, head-in-pillow, cold joints, opens, warpage); Evaluate and select solder paste and fluxes based on pad design and component pitch; Develop and validate reflow oven profiles for chip packages; Define stencil design specifications; Review and approve PCB landing pad designs; Collaborate with R&D on Package-to-Board interaction guidelines; Provide advice on substrate design and surface finishes.
Seniority
Senior, hands-on IC
