CareerPlan

Principal SoC Chip Lead

Shanghai (Pudong), CNFull-time2026-08-04 → 2026-11-11

Core

Lead end-to-end SoC program execution from architecture definition through tape-out and post-silicon support, ensuring on-time delivery and coordinating engineering teams.

Role type

Principal SoC Chip Lead

Builds

System-on-Chip (SoC) products

Domain

Semiconductor / SoC Design

Required skills

SoC architecture, RTL design, integration, verification, DFT, emulation, physical design, silicon validation, cross-functional team leadership, project execution, risk management

Preferred skills

Automotive or safety-critical semiconductor experience, global team management, multiple tape-out delivery

Technologies

SoC flows, RTL, DFT, Emulation, Physical Design

Responsibilities

Own SoC program execution from project definition through tape-out and post-silicon support; Drive technical decision-making across architecture, integration, verification, implementation, validation, and system teams; Lead and align Architecture, RTL, DFT, Verification, Emulation, Physical Design, AMS, IP, and related engineering teams; Develop and maintain project execution plans and monitor schedule, resource demand, and risk mitigation; Partner with Product Marketing, System Architecture, System Engineering, NPI PM, BU management, and external stakeholders; Own overall tape-out readiness and coordinate post-silicon validation activities

Seniority

Principal, hands-on IC