Principal SoC Chip Lead
Core
Own SoC program execution from project definition through tape-out and post-silicon support, ensuring on-time delivery and coordinating engineering support during silicon bring-up and validation.
Role type
Principal SoC Chip Lead
Builds
System-on-Chip (SoC) products
Domain
Semiconductor / Hardware Design
Deliverable
production ML models | product features | infrastructure
Required skills
SoC development flows (Architecture, RTL, Verification, DFT, Physical Design), cross-functional team leadership, project execution planning, risk management, tape-out readiness management
Preferred skills
Automotive or safety-critical semiconductor product experience, global distributed team management, multiple successful SoC tape-outs
Technologies
RTL, DFT, Emulation, Physical Design, AMS, IP
Responsibilities
Drive technical decision-making across architecture, integration, verification, implementation, and system teams; Lead and align Architecture, RTL, DFT, Verification, Emulation, Physical Design, AMS, IP, and related engineering teams; Develop and maintain project execution plans and monitor schedule, resource demand, and critical paths; Own overall tape-out readiness including integration quality and signoff closure; Coordinate post-silicon validation activities and engineering resources for silicon bring-up and issue resolution
Seniority
Principal, hands-on IC & technical leadership