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Principal SoC Chip Lead

Shanghai (Pudong), CN💼 Full-time🗓 2026-08-04 → 2026-09-26

Core

Own SoC program execution from project definition through tape-out and post-silicon support, ensuring on-time delivery and coordinating engineering support during silicon bring-up and validation.

Role type

Principal SoC Chip Lead

Builds

System-on-Chip (SoC) products

Domain

Semiconductor / Hardware Design

Deliverable

production ML models | product features | infrastructure

Required skills

SoC development flows (Architecture, RTL, Verification, DFT, Physical Design), cross-functional team leadership, project execution planning, risk management, tape-out readiness management

Preferred skills

Automotive or safety-critical semiconductor product experience, global distributed team management, multiple successful SoC tape-outs

Technologies

RTL, DFT, Emulation, Physical Design, AMS, IP

Responsibilities

Drive technical decision-making across architecture, integration, verification, implementation, and system teams; Lead and align Architecture, RTL, DFT, Verification, Emulation, Physical Design, AMS, IP, and related engineering teams; Develop and maintain project execution plans and monitor schedule, resource demand, and critical paths; Own overall tape-out readiness including integration quality and signoff closure; Coordinate post-silicon validation activities and engineering resources for silicon bring-up and issue resolution

Seniority

Principal, hands-on IC & technical leadership

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