Internship - Design of a compact solder joint resistance sensor
Core
Design a compact on-chip sensor to measure solder joint resistance (200mΩ range, 100μΩ resolution) for failure prediction in automotive and robotics PCB interconnects.
Role type
IC design engineer (sensor/analog)
Builds
A prototype chip in 160nm technology
Domain
Automotive electronics / Analog IC design
Required skills
Analog circuit design, Sensor design, Low-power design, Ratiometric measurement techniques, PCB interconnect analysis, Chip tape-out, 160nm process knowledge
Preferred skills
Failure prediction algorithms, High-resolution ADC design, Current sensing
Technologies
160nm CMOS, Analog front-end, On-chip reference resistors
Responsibilities
Design the sensor circuit to achieve 100μΩ resolution with minimized force current, Ensure accuracy over time using ratiometric measurement, Complete the design and tape-out of the prototype chip
Seniority
Internship
