Wire Bond Equipment Engineer
Core
Lead wire bond equipment overhaul, rebuild, and preventive maintenance to ensure machine uptime and reliability for semiconductor assembly operations.
Role type
Senior IC wire bond equipment engineer
Builds
Wire bond machines and automation systems for semiconductor assembly
Domain
Semiconductor manufacturing / Electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
wire bond machine overhaul and rebuild, preventive and predictive maintenance, root cause analysis, continuous improvement (Lean, Six Sigma), automation system development, equipment calibration, technical training and mentorship
Preferred skills
data analytics, machine connectivity projects
Technologies
wire bond machine platforms
Responsibilities
Lead equipment overhaul and rebuild activities, develop preventive maintenance programs, analyze downtime and implement corrective actions, drive continuous improvement initiatives, collaborate on production goals, develop automation solutions, provide technical training, ensure compliance with safety and quality standards, lead productivity and cost-reduction projects
Seniority
Senior, hands-on IC