<2026 Internship Program> Process Engineer Intern (Wire Bonding)
Core
Support production operations and yield improvements for wire bonding processes through plasma cleaning studies.
Role type
Process Engineer Intern (Wire Bonding)
Builds
Wire bonding production lines
Domain
Semiconductor manufacturing / Materials Science
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Plasma cleaning principles, Wire bonding structures (Integrity Chip die pad/wire type/Lead-post), MS Office, Programming
Preferred skills
Self-motivation, Results orientation, Proactive attitude
Responsibilities
Monitor production operations, Assist with system monitoring confirmations, Study plasma cleaning for yield improvements
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