Staff Equipment Development Engineer - Advanced Packaging
Core
Develop and optimize next-generation, first-of-a-kind wafer and die equipment for semiconductor manufacturing.
Role type
Staff Equipment Development Engineer (Advanced Packaging)
Builds
Next-generation semiconductor memory and storage products
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | infrastructure
Required skills
Equipment maturity strategy, hardware roadmap planning, cost reduction optimization, root cause analysis, failure mode analysis, DOE, SPC, defect analysis, data analysis, wafer/assembly tool operation, overlay systems
Preferred skills
Robotics knowledge, machine logic language, new hardware design, wafer/die bonding, plating, warpage control
Technologies
Wafer and assembly tools, overlay systems, OEM vendor equipment
Responsibilities
Develop strategies to improve equipment maturity for FOAK hardware; Develop hardware roadmaps for post probe wafer and die processing; Optimize equipment to reduce cost and increase availability; Collaborate with process development teams; Conduct root cause and failure mode analysis; Perform fundamental research for next-generation equipment; Support equipment transfer to production facilities
Seniority
Staff, hands-on IC with strategic influence
