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Principal TCAD Device Engineer

Boise, ID - Main Site💼 Full-time🗓 2026-04-21 → 2026-07-31

Core

Drive process and device modeling for advanced memory technologies using TCAD and AI tools to guide experiments and fix complex device/circuit issues before silicon fabrication.

Role type

Principal TCAD Device Engineer (IC)

Builds

Virtual device models and optimized process flows for next-generation memory technologies

Domain

Semiconductor manufacturing / Memory technology / Device physics

Deliverable

production ML models | product features

Required skills

MOSFET device physics, semiconductor process integration, TCAD simulation, CMOS/memory process flows, sub-10nm device physics, cross-functional collaboration

Preferred skills

DRAM/emerging memory/3D NAND experience, FinFET/nanosheet/HKMG architectures, thermal/stress modeling (FEM), electrical characterization, Python scripting for automation

Technologies

TCAD tools, Python, FEM tools

Responsibilities

Perform process and device simulations using advanced TCAD tools; Design virtual DOEs to guide process experiments; Use AI and Python-based automation to enhance TCAD workflows; Analyze device and circuit issues during technology development; Collaborate with cross-functional teams to connect modeling with silicon results

Seniority

Principal, hands-on IC with strategy & mentorship

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