Engineer, Product Engineering (Media Health Reliability), Heteregenous Integration - High Bandwidth Memory
Core
Develop reliability test flows and plans for High Bandwidth Memory (HBM) products, manage qualification execution, and drive root cause analysis for device defects to ensure quality and yield.
Role type
Senior IC reliability engineer (semiconductor manufacturing) (via careerplan.io/jobs/JR97871-engineer-product-engineering-media-health-reliability-heteregenous-integration-high-bandwi)
Builds
HBM memory products for data centers, AI, and 5G applications
Domain
Semiconductor manufacturing / Memory technology
Required skills
root cause analysis, electric failure analysis (EFA), physical failure analysis (PFA), CMOS technology knowledge, DRAM architecture understanding, data analysis, statistics, Python scripting, JMP
Preferred skills
semiconductor device coursework, internship in product validation, problem-solving methodologies
Technologies
Python, JMP, CMOS, DRAM
Responsibilities
Define and develop reliability stress test flows and plans; manage qualification execution progress with the Global Quality team; drive down Extrinsic and Intrinsic Reliability (DPM) through optimized test strategies; debug and identify root causes of device failures using EFA and PFA; provide recommendations to fab teams for process conversions to improve yield and reduce cost; manage risks associated with DPM process conversions; collaborate with cross-functional teams including Fab, Design, and System Development.
Seniority
Senior, hands-on IC
