Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)
Core
Lead global Product Integration efforts to improve yield, quality, and benchmark performance across semiconductor technologies and products.
Role type
Senior IC Product Integration Engineer (Semiconductor)
Builds
Scalable network-wide solutions for yield, quality, and New Product Introduction (NPI) in memory and storage.
Domain
Semiconductor manufacturing (DRAM, HBM, BEOL, Packaging) (via careerplan.io/jobs/JR96896-front-end-central-product-integration-engineer-test-product-yield-integration-senior-staff)
Required skills
Semiconductor device physics, DRAM product operation, wafer fabrication, electrical/parametric testing, data analysis, debugging, technical problem solving
Preferred skills
DRAM High Bandwidth Memory (HBM) products, advanced DRAM technologies, advanced packaging, chip-package interaction, layout topics
Technologies
BEOL integration, HPM, DRAM
Responsibilities
Lead cross-functional global task forces to resolve yield and quality issues; Define and execute strategies for Packaging Technology and Chip-Package Interaction readiness; Integrate cross-site project data (design, test, yield, manufacturing) to closure; Develop, standardize, and deploy best-known methods (BKMs) and business processes; Communicate status, risks, and technical proposals to leadership.
Seniority
Senior, hands-on IC with global leadership