ENGINEER, UNIFORMITY PROCESS DEV
Core
Develop and transfer regE processes for next-generation 3D NAND nodes, focusing on process margin improvement, wafer edge defect resolution, and manufacturability for high-volume manufacturing.
Role type
Process Development Engineer (3D NAND)
Builds
3D NAND memory nodes and storage solutions
Domain
Semiconductor manufacturing / Memory technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
regE process development, yield improvement, wafer edge defect analysis, Design of Experiments (DoE), data analysis systems (Y3), process flow understanding for planar and vertical NAND, multi-functional project leadership, technical project definition, supplier engagement, advanced process monitoring and control methodologies
Preferred skills
Materials Science, Chemical Engineering, or Physics background, experience with 3D NAND integration constraints, ability to work extended hours, patent and technical paper generation
Technologies
Y3 data analysis systems, regE process tools, 3D NAND fabrication equipment
Responsibilities
Own process modules for regE characterizations and advanced developments, transfer regE processes to high volume manufacturing, address wafer edge issues like bevel defects and uniformity, initiate experiments to widen process margins, incorporate best manufacturing methods into early development, lead complex multi-functional projects for quality and yield improvement, provide technical counsel to management, collaborate with global teams and suppliers
Seniority
Mid-level, hands-on IC