Senior/Staff Engineer, Product Engineering, Media Health Manufacturing, HIG-HBM
Core
Lead a team to develop and execute reliability test flows for High Bandwidth Memory (HBM) products, driving defect reduction and process improvements for DRAM and Interface dies.
Role type
Senior/Staff Product Engineering Manager (Semiconductor Reliability)
Builds
HBM memory products (DRAM and Interface die) for data centers, AI, and high-performance computing
Domain
Semiconductor manufacturing / Memory technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Reliability test flow development, Root cause analysis (EFA/PFA), Statistics and data analysis, Circuit analysis, Cross-functional collaboration, Project management, Team leadership, Process conversion strategy
Preferred skills
Product Engineering experience, Semiconductor industry background
Technologies
EFA, PFA, Manufacturing Test Flows, DRAM, HBM
Responsibilities
Define and develop reliability stress test flows and plans; Drive extrinsic and intrinsic reliability improvements (DPM reduction); Debug and resolve qualification and RMA failures via failure analysis; Provide recommendations for fab process conversions to improve yield and reduce cost; Manage risks associated with process conversions; Mentor team members; Collaborate with Fab, Design, and Quality teams.
Seniority
Senior/Staff, hands-on IC with leadership
