ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)
Core
Engineer supporting the transition of next-generation memory and HBM packaging technologies from development to high-volume manufacturing.
Role type
Individual contributor, NPI/Package Development Engineer
Builds
High-volume manufacturing processes for advanced memory packaging
Domain
Semiconductor manufacturing, Advanced Packaging, HBM
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Design of Experiments (DOE), Failure Mode & Effect Analysis (FMEA), risk assessment, statistical methods, technology transfer, shift management
Preferred skills
MES systems, automation, data analytics tools (JMP, Python), semiconductor industry experience, leadership
Technologies
JMP, Python, MES systems
Responsibilities
Integrate AI-assisted tools to improve efficiency and quality; Apply engineering and statistical methods to accelerate learning cycles from DOE through product qualifications; Partner with development and manufacturing teams to support Low Volume Manufacturing (LVM) and Run at Risk (RAR); Perform risk assessments (FMEA) and implement control plans for abnormal conditions; Enable smooth technology transfer from development to high-volume manufacturing.
Seniority
Individual contributor, operations support
