Product Yield Enhancement Engineer, HBM
Core
Perform electrical failure analysis and fault isolation on next-generation HBM devices to identify physical defects from process or assembly steps, ensuring product reliability and rapid production ramp.
Role type
Product Yield Enhancement Engineer (HBM Electrical Failure Analysis)
Builds
Next-generation High Bandwidth Memory (HBM) devices
Domain
Semiconductor manufacturing, HBM technology, CMOS/FinFET fabrication
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Electrical failure analysis, fault isolation, emission and laser techniques, EOTPR, backend test characterization, RMA failure signature analysis, PFA and de-processing techniques, CMOS/FinFET process knowledge, UNIX/Linux scripting (Tcl, Bash, SHELL)
Preferred skills
Master's degree in EE or Material Science, extensive physical and logical design understanding, package assembly and fabrication process knowledge, reliability and quality analysis experience
Technologies
Emission, laser techniques, EOTPR, UNIX/Linux, Tcl, Bash, SHELL
Responsibilities
Perform Electrical Failure Analysis and Fault Isolation using methods such as emission, laser techniques, and EOTPR; Characterize or model backend test, internal qualification, and RMA fail signatures; Understand various PFA and de-processing techniques for failures; Maintain an in-depth understanding of CMOS/FinFET process fabrication levels, steps, and methodologies; Generate organized and timely failure analysis reports with clearly communicated causes and effects; Coordinate failure analysis findings with Management, Product, Process, Assembly, and Global Quality teams
Seniority
Mid-level IC (2-5 years experience)
