Staff Engineer, Package Reliability
Core
Ensuring package quality and reliability for Micron's DRAM and HBM product lines through end-to-end qualification, phase gate approvals, and HVM monitoring.
Role type
Staff Engineer, Package Reliability (IC Packaging)
Builds
High-performance memory and storage products (DRAM, HBM, 3DS packages)
Domain
Semiconductor manufacturing / Memory and Storage
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor component package assembly processes, Mechanical and material interaction effects on IC reliability, Thermo-mechanical and hygroscopic stress analysis, Industry standard reliability test methods, Acceleration models for life predictions, Sampling statistics
Preferred skills
HBM and 3DS packaging experience, Failure Analysis, Materials characterization, Data analysis and reliability modelling, Backend manufacturing software systems (MAM, MES, JMP, Tableau)
Technologies
MAM, MES, JMP, Tableau
Responsibilities
Coordinate package qualification efforts for new products and design/material/process introductions, Provide inputs and approve phase gates for product release, Devise reliability test plans to assess risk associated with excursions and conversions, Coordinate root cause and corrective action efforts for GCP failures, Prepare reports to address critical issues, Engage in phase gate review from design to production release to ensure CTQ compliance
Seniority
Staff, hands-on IC with strategic oversight
