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IO Design Architect – High Speed Memory Interfaces (m/f/d)

Munich (MDC), Germany🌐 Remote💼 Full-time💰 $117,000–$205,000🗓 2026-06-12 → 2026-07-31

Core

Design new architecture, analysis, and validation of high-speed memory IO interfaces, combining hands-on circuit understanding with system-level thinking.

Role type

Senior IC IO Design Architect (High-Speed Memory)

Builds

Next-generation memory technologies (DRAM, NAND, NOR) and mixed-signal IO solutions

Domain

Semiconductor / High-Speed Memory Interfaces

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Mixed-signal IO block design, Schematic design, Circuit simulation (SPICE), Schematic entry (Cadence/Synopsys), Block-level behavior modeling, Unix/Linux environments

Preferred skills

Scripting (Python, TCL, SKILL, Perl), Extraction and modeling tools, Cross-functional design team collaboration

Technologies

Cadence, Synopsys, SPICE, Unix/Linux

Responsibilities

Define and own IO and PHY concepts for high-speed memory interfaces, Perform block-level simulation, analysis, and feasibility checks, Review and guide schematic-level implementation, Support verification, silicon bring-up, and debug activities, Collaborate with global cross-functional teams, Use automation and AI-based tools to improve modeling workflows

Seniority

Senior, hands-on IC

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