Principal Engineer, (NAND Cell Film Process)
Core
Define technical strategy and lead multi-functional teams in developing, integrating, and scaling thin film processes for advanced NAND memory devices.
Role type
Principal Engineer, Process Development (Cell Film)
Builds
Next-generation NAND memory devices and high-volume manufacturing processes
Domain
Semiconductor manufacturing, NAND memory technology
Required skills
Thin film deposition (ALD, CVD), process-device interaction analysis, reliability engineering, failure analysis, statistical process control (SPC), design of experiments (DOE), cross-disciplinary team leadership, technology transfer, cost reduction and yield improvement
Preferred skills
Advanced characterization techniques (XRR, SEM, TEM, SIMS, XPS), device physics (MOSFET, 3D NAND), regulatory compliance, intellectual property management
Technologies
Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), X-ray Reflectivity (XRR), Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Secondary Ion Mass Spectrometry (SIMS), X-ray Photoelectron Spectroscopy (XPS)
Responsibilities
Define and implement technical strategy for cell film process development; Lead multi-functional teams in scaling thin film processes; Oversee end-to-end development of process modules; Resolve complex technical challenges and perform root cause analysis; Mentor senior engineers; Represent the function in technical forums and industry consortia; Drive technology transfer from R&D to manufacturing; Identify emerging trends and risks; Lead cost reduction and yield improvement programs
Seniority
Principal, strategic leadership and hands-on technical direction