Principal Engineer, (NAND Cell Film Process)
Core
Define technical strategy and lead the development, integration, and scaling of thin film processes for advanced NAND memory devices.
Role type
Principal Engineer, Process Development (Cell Film)
Builds
Next-generation NAND memory nodes and high-volume manufacturing processes
Domain
Semiconductor manufacturing, NAND flash memory, thin film deposition
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Thin film deposition (ALD, CVD), process-device interaction analysis, reliability engineering, device physics (MOSFET, 3D NAND), failure analysis, statistical process control (SPC), design of experiments (DOE), material chemistry, chamber/plasma optimization, yield improvement, technology transfer
Preferred skills
Industry consortium participation, competitive benchmarking, cost reduction program leadership, emerging trend identification
Technologies
Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), X-ray Reflectivity (XRR), ellipsometry, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Secondary Ion Mass Spectrometry (SIMS), X-ray Photoelectron Spectroscopy (XPS)
Responsibilities
Define technical strategy for cell film process development; lead multi-functional teams in scaling thin film processes; oversee end-to-end development of process modules; resolve complex technical challenges and perform root cause analysis; mentor senior engineers; represent the function in technical forums and industry consortia; drive technology transfer from R&D to manufacturing; lead cost reduction and yield improvement programs
Seniority
Principal, strategic leadership & hands-on technical execution