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SENIOR ENGINEER - DEMQRA HBM

Taichung - Fab 16, Taiwan💼 Full-time🗓 2026-04-24 → 2026-07-31

Core

Establishing quality criteria and monitoring quality indices for High Bandwidth Memory (HBM) from NPI to high-volume manufacturing, driving action to prevent quality and reliability issues.

Role type

Senior IC Quality and Reliability Assurance Engineer (Semiconductor)

Builds

HBM and high-performance memory solutions

Domain

Semiconductor manufacturing, advanced packaging, and device physics

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Semiconductor wafer fabrication knowledge, advanced packaging expertise, failure analysis, characterization techniques, stress/strain modeling, experiment design, statistical data analysis, Perl/C++/Python programming

Preferred skills

Microsoft Office proficiency, HTML/CGI/Java familiarity

Technologies

Perl, C++, Python, semiconductor test methodologies

Responsibilities

Define and monitor outgoing quality and reliability metrics based on production signals; Partner with package and product engineers to define quality fail modes; Evaluate and mitigate quality risks for new products; Collaborate with MFG QA teams to improve fail mode lists; Set and validate OQR specifications; Disposition deviation material; Facilitate communication between Process Integration, Product Engineering, and Quality Teams; Partner with 8D teams to find root causes and implement corrective actions; Develop product reliability methodologies; Generate and optimize reliability test flows.

Seniority

Senior, hands-on IC

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