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ADTT Dry Etch MTS/SMTS

Taichung - Fab 16, Taiwan💼 Full-time🗓 2025-08-12 → 2026-07-31

Core

Lead the development, characterization, and optimization of Dry Etch processes for advanced DRAM structures.

Role type

Senior IC semiconductor process engineer (dry etch)

Builds

Advanced DRAM memory structures

Domain

Semiconductor manufacturing / Memory technology

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Dry Etch process development, Plasma etch mechanisms, Process control, Defect mitigation, Cross-functional team leadership, Root cause analysis, Technical roadmap definition, Equipment vendor interface

Preferred skills

High aspect ratio etching, Critical dimension control, Selectivity challenges, Data analytics, DOE methodologies, SPC tools, Sub-20nm integration challenges

Technologies

Lam, TEL, AMAT

Responsibilities

Lead development and optimization of Dry Etch processes for DRAM, Collaborate with integration and metrology teams, Define technical roadmaps for DRAM scaling, Evaluate new etch technologies and hardware, Mentor junior engineers, Interface with equipment vendors, Drive root cause analysis and continuous improvement, Present findings to executive leadership

Seniority

Senior, hands-on IC

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