Principal Plating Engineer
Core
Leads complex electroplating projects, develops processes for 300mm wafer plating systems, and maintains equipment uptime for the Advanced Electronics and Photonics Core Facility.
Role type
Principal Plating Engineer (Senior IC)
Builds
300mm wafer plating systems and associated chemical metrology systems
Domain
Semiconductor manufacturing / Electroplating / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
electroplating process development, chemical metrology, statistical process control, equipment maintenance, semiconductor advanced packaging, thin film processing, JMP/Minitab, active matrix TFT processing, amorphous-silicon processes
Preferred skills
MS in Chemical/Materials/Physics Engineering, strong mechanical aptitude, cross-training in etching/deposition/cleaning
Technologies
JMP, Minitab, 300mm wafer plating systems
Responsibilities
Maintain electroplating equipment and increase uptime, develop new electroplating processes, write safety procedures for users, supervise junior engineers, interact with device physics and deposition teams, recommend future equipment procurement
Seniority
Principal, hands-on IC with mentorship
