DRAM Pathfinding & Process Integration Engineer
Core
Lead early-phase technology investigation and process integration for next-generation DRAM architectures, defining requirements and translating them into coordinated process solutions.
Role type
Senior IC process integration engineer (semiconductor R&D)
Builds
Next-generation DRAM technologies and process flows
Domain
Semiconductor manufacturing / Memory technology
Deliverable
production ML models
Required skills
Semiconductor process integration, DRAM technology knowledge, DOE methodologies, statistical analysis, High-NA EUV lithography, AI-assisted analytics, cross-functional technical leadership
Preferred skills
Ph.D. in EE/Physics/Materials Science, EUV/High-NA EUV experience, technology scouting, Python/JMP/SQL/machine learning proficiency
Technologies
High-NA EUV, DOE tools, JMP, SQL, Python, AI/ML modeling frameworks
Responsibilities
Lead investigation of upcoming DRAM technology concepts and materials; Develop and integrate novel process flows for next-gen DRAM; Evaluate process interactions affecting pattern fidelity and yield; Build and complete DOE plans and technology learning experiments; Analyze electrical, defectivity, and yield data using statistical methodologies; Support transition of pathfinding concepts into technology development
Seniority
Senior, hands-on IC