CMP/Bond Process Engineer
Core
Develop and improve Chemical Mechanical Polishing (CMP) and Bonding processes for DRAM manufacturing, managing technology transfer from R&D to production.
Role type
Process Engineer (Semiconductor Manufacturing)
Builds
DRAM memory chips
Domain
Semiconductor manufacturing / Memory and storage
Required skills
DOE design, process development, yield analysis, reliability engineering, vendor management, experimental design, technology transfer, manufacturing integration, AI utilization for process efficiency
Preferred skills
Multi-level SWR design, next-node solution testing, inline/probe data analysis
Technologies
CMP equipment, Bonding equipment, DRAM fabrication tools, DOE frameworks, AI tools
Responsibilities
Support CMP/Bond process development and technology transfer; Identify and resolve equipment/process interactions; Resolve yield and reliability issues; Manage experiments to widen process margins; Incorporate best manufacturing methods into early development; Provide technical documentation for technology transfer.
Seniority
Mid-level, hands-on IC