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Intern - ID1 Process Engineer

Boise, ID - ID1, US💼 Internship🗓 2026-09-23 → 2026-09-25

Core

Support process optimization, yield improvement, throughput enhancement, and issue resolution within a semiconductor manufacturing area.

Role type

High Volume Manufacturing Process Engineer Intern

Builds

Next-generation DRAM production and advanced manufacturing capabilities

Domain

Semiconductor manufacturing (DRAM)

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Statistical Process Control (SPC), Design of Experiments (DOE), data analysis, Python, Java, MATLAB, Tableau, Microsoft Office, structured problem-solving (8D), Artificial Intelligence tools

Preferred skills

Data collection systems, data warehousing, data cleansing, database querying, semiconductor fabrication processes, manufacturing equipment, advanced analytics

Technologies

Python, Java, MATLAB, Tableau, Microsoft Office

Responsibilities

Monitor process performance and analyze data to support throughput and wafer output goals; Identify, troubleshoot, and resolve process issues affecting yield or production; Apply SPC, FDC, DOE, and 8D methodologies to improve process capability; Partner with operations and engineering to address chronic process issues; Leverage AI and data analytics to optimize wafer processing.

Seniority

Intern

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