DRAM Process Integration Engineer
Core
Enable manufacturability of advanced DRAM technologies by solving complex integration, device, yield, and circuit challenges.
Role type
Senior IC process integration engineer (semiconductor)
Builds
Next-generation memory technologies (DRAM) in 300mm R&D environment
Domain
Semiconductor manufacturing / Memory technology
Deliverable
production ML models | product features
Required skills
Semiconductor device physics, process integration, DRAM/NAND technology knowledge, process development, cross-functional problem solving, data analysis, design of experiments (DOE), statistical techniques
Preferred skills
AI-assisted analytics, anomaly detection, yield improvement initiatives, alternative memory technologies knowledge
Technologies
300mm R&D environment, inline data systems, defect analysis tools, parametric analysis tools, probe data systems
Responsibilities
Lead technology integration activities to enable manufacturability of advanced DRAM technologies; Partner with cross-functional teams to resolve yield, performance, reliability, and margin challenges; Design and implement R&D fab experiments and optimize process flows; Analyze inline, defect, parametric, and probe data to identify root causes and drive improvements; Lead cross-functional problem solving by summarizing technical issues and driving actions to implementation