Principal Engineer (Advance Data Analytics), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering
Core
Leading a team of engineers to build predictive models for screening, dispositioning, and testing High Bandwidth Memory (HBM) in high-volume manufacturing.
Role type
Principal Engineer (People Manager & Technical Lead)
Builds
Predictive models for yield loss, defect escapes, and reliability risk; scalable data pipelines for manufacturing data.
Domain
Semiconductor manufacturing / High Bandwidth Memory (HBM) / Predictive Analytics
Deliverable
production ML models
Required skills
People leadership and team management, Gradient-boosted tree methods (XGBoost, LightGBM, CatBoost), Time-series and temporal modeling, Production ML deployment and monitoring, Large-scale data pipeline development, Python and SQL programming, Cloud platform experience (GCP, AWS, Azure)
Preferred skills
Semiconductor manufacturing domain knowledge, Yield prediction modeling, Memory product expertise, GenAI and agentic systems application
Technologies
XGBoost, LightGBM, CatBoost, PySpark, BigQuery, pandas, scikit-learn, matplotlib, plotly, GCP, AWS, Azure
Responsibilities
Mentor and develop team members, Set technical direction and review modeling work, Design and validate predictive models for yield and reliability, Build and operate model deployment paths with drift control, Develop scalable data pipelines for heterogeneous datasets, Apply GenAI for engineering automation and knowledge retrieval, Collaborate with cross-functional teams on fail-mode definitions and screening conditions
Seniority
Principal, hands-on IC with people management responsibilities