Process Engineer, APTD
Core
Optimize automation, equipment, and process performance to improve product quality, reliability, and cost for next-generation memory and storage solutions.
Role type
Process Engineer (Semiconductor Packaging)
Builds
Scalable semiconductor manufacturing solutions and pilot line operations
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | infrastructure
Required skills
Root cause analysis, Design of Experiments (DOE), Statistical Process Control (SPC), Defect analysis, Data analysis, Project management
Preferred skills
AI tools application, Automation development, Data-driven process improvement, Cross-functional collaboration
Technologies
FMEA, 8D, SPC, FDC, DOE
Responsibilities
Optimize automation and process performance; Develop host and data systems; Perform root cause analysis and failure investigations; Partner with equipment and process teams; Support pilot line operations and technology transfer
Seniority
Mid-level, hands-on IC
