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Engineer, Real Time Defect Analysis

Fab 10N/X, Singapore💼 Full-time🗓 2026-09-01 → 2026-09-26

Core

Drive yield, quality, and process improvements in advanced semiconductor manufacturing through defect characterization, root cause analysis, and process optimization.

Role type

Semiconductor process engineer (defect analysis)

Builds

High-performance DRAM, NAND, and NOR memory and storage products

Domain

Semiconductor manufacturing / Memory and storage

Deliverable

production ML models | product features

Required skills

Defect characterization, root cause analysis, process optimization, equipment/material evaluation, yield maximization, AI tool integration, process deviation control

Preferred skills

Semiconductor industry experience, leadership, AI literacy

Technologies

AI-assisted tools, wafer fabrication tools

Responsibilities

Troubleshoot wafer fabrication problems and perform root cause analysis, maximize yield by working on tools/process/recipes, evaluate new equipment and materials, conduct research to assess process adjustment requirements, integrate AI tools to improve efficiency and quality, collaborate with cross-functional teams on process deviations

Seniority

Mid-level IC

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