CareerPlan

Engineer, Real Time Defect Analysis

Fab 10N/X, SingaporeFull-time2026-09-01 → 2026-11-15

Core

Drive yield, quality, and process improvements in advanced semiconductor manufacturing through defect characterization, root cause analysis, and process optimization.

Role type

Semiconductor process engineer (defect analysis)

Builds

Advanced semiconductor memory and storage products (DRAM, NAND, NOR)

Domain

Semiconductor manufacturing

Deliverable

production ML models

Required skills

Defect characterization, root cause analysis, process optimization, yield improvement, equipment/material evaluation, AI tool integration, process deviation control

Preferred skills

Semiconductor industry experience, leadership, AI literacy

Technologies

AI-assisted tools, wafer fabrication tools

Responsibilities

Troubleshoot wafer fabrication problems and perform root cause analysis, maximize yield by working on tools/process/recipes, evaluate new equipment and materials, conduct research to assess process adjustment requirements, integrate AI tools to improve efficiency and quality, collaborate with cross-functional teams on process deviations

Seniority

Individual Contributor (IC), mid-to-senior level