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DRAM Technology Transfer Process Integration Engineer

Taoyuan - Fab 11, Taiwan💼 Full-time🗓 2026-09-15 → 2026-09-26

Core

Lead DRAM technology transfer efforts between development and manufacturing locations to optimize device performance and manufacturability.

Role type

Senior IC process integration engineer (semiconductor manufacturing)

Builds

DRAM memory and storage products

Domain

Semiconductor manufacturing / Memory technology

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

DRAM technology knowledge, semiconductor process integration, yield analysis, statistical data analysis, process change assessment, manufacturing risk identification

Preferred skills

Tech node transfer (NPI to HVM), risk assessment, problem-solving, FMEA, risk mitigation planning

Technologies

AI Assisted tools

Responsibilities

Lead DRAM technology transfer efforts between development and manufacturing locations, Coordinate transfer achievements, qualification plans, and execution readiness reviews, Drive issue resolution during transfer ramp and production transition, Analyze process interactions across modules to optimize device performance and manufacturability, Conduct process change assessments and identify potential manufacturing risks

Seniority

Senior, hands-on IC

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